Call for Papers
VLSI-SoC 2016 is the 24th in a series of international conferences sponsored by IFIP TC 10 Working Group 10.5, IEEE CEDA and IEEE CASS, which explores the state-of-the-art in the areas that surround Very Large Scale Integration (VLSI) and System-on-Chip (SoC). Previous conferences have taken place in Edinburgh, Trondheim, Tokyo, Vancouver, Munich, Grenoble, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice, Atlanta, Rhodes, Florianópolis, Madrid, Hong Kong, Santa Cruz, Istanbul, Playa del Carmen, and Daejeon in South Korea. The purpose of VLSI-SoC is to provide a forum to exchange ideas and showcase research as well industrial results in EDA, design methodology, test, design, verification, devices, process, systems issues and application domains of VLSI and SoC.
VLSI-SoC 2016 will take place in Tallinn whose picturesque Old Town with its fascinating medieval architecture and slender church spires is included in the UNESCO World Heritage list.
Topics of interest include but are not limited to:
• Analog and mixed-signal IC design
• CAD: synthesis and analysis
• Circuits and systems for signal processing and communications
• Design for variability, reliability, and test
• Embedded system: architecture, design, and software
• Low-power and thermal-aware design
• Memory: technology, circuit, and system
• Prototyping, verification, modeling, and simulation
• System architectures: NoC, 3D, multi-core, and reconfigurable
Paper Submission (more details):
Papers should present original research and industrial results not published or submitted for publication in other forums. The proceedings will be published by IEEE and available through IEEE Xplore.
A selection of the conference best papers will be invited to submit an extended version to be included as chapters of a book to be published by Springer.
Important Dates (extended!):
Abstract registration deadline April 18, 2016 April 27, 2016
Full paper submission deadline April 27, 2016 May 4, 2016
Special Session Proposal: April 27, 2016 May 4, 2016
Notification of acceptance June 18, 2016 June 27, 2016
Final version due July 10, 2016 July 18, 2016