Feb 25, 2018
Tutorials at ETS'05
to get to the TUT Campus at Mustamäe?
From the city center, take trolley no 3 opposite Kaubamaja (Tallinn Department
Store) to Keemia stop. It takes about half an hour.
parallel TTEP tutorials will be presented at the ETS on Sunday, May 22 with
special low rates:
System-on-Chip: Embedded Test in Practice
Presenter: YERVANT ZORIAN – Virage Logic
SoC Designers, test engineers and researchers interested in learning about the
state-of-the-art in embedded test methods for complex systems-on-chip and beyond.
Spurred by technology leading to the availability of millions of gates per chip,
system-level integration is evolving as a common paradigm, allowing entire systems
to be built on a single chip. This tutorial presents the state-of-the-art in
system-level integration and addresses the strategies and current industrial
practices in the test of system-on-chip. It discuees the requirements for test
reuse in hierarchical design, such as embedded test strategies for individual
cores, test access mechanisms, test interface standardization, optimizing test
resource partitioning, and embedded test management and integration at the System-on-Chip
level and beyond. Several industrial experiences will be shared with the audience.
Design-for-Test of Analog and Mixed-Signal Integrated Circuits
Presenter: JOSE LUIS HUERTAS – IMSE-CNM
Test engineers for analog and mixed-signal integrated circuits as well as analog
designers and system designers involved in the design and implementation of
complex System-on-Chip using analog and digital modules.
This tutorial aims to introduce circuit designers into the problems of making
analog and mixed-signal ICs more testable. This fact worth attention for specific
circuit classes, since there is no universal method valid for any kind of analog
and/or mixed-signal funtion. In particular, during this tutorial, attention
will be paid to integrated filters (Switched-Capacitor and continuous-time),
integrated A/D and D/A converters, and PLLs and oscillators as well as the problems
when these components are embedded in a SoC.